Polight publishes its financial reports since its IPO at Oslo stock exchange last year. The reports show that selling AF actuator is quite a tough business:
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Polight Annual Report
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Samsung Announces 64MP 0.8um Pixel Sensor for Smartphones
Samsung introduces two new 0.8μm pixel CMOS sensors – the 64MP Samsung ISOCELL Bright GW1 and 48Mp ISOCELL Bright GM2. With this, Samsung expands its 0.8μm image sensor lineup from existing 20MP to 64MP resolutions.
“With more pixels and advanced pixel technologies, Samsung ISOCELL Bright GW1 and GM2 will bring a new level of photography to today’s sleekest mobile devices that will enhance and help change the way we record our daily lives,” said Yongin Park, EVP of sensor business at Samsung Electronics.
With pixel-merging Tetracell technology and remosaic algorithm, GW1 can produce 16MP images in low-light environments and highly-detailed 64MP shots in brighter settings. GW1 supports real-time HDR of up to 100dB. In comparison, the dynamic range of a conventional image sensor is at around 60dB, while that of the human eye is typically considered to be around 120dB.
GW1 is equipped with a Dual Conversion Gain (DCG) that converts the received light into an electric signal according to the illumination of the environment. This allows the sensor to optimize its FWC. Sharper results can be delivered through Super PD, a high-performance phase detection auto-focus technology, and full HD recording at 480fps is supported.
ISOCELL Bright GM2 is a 48MP image sensor that also adopts Tetracell technology in low-light environments and a remosaic algorithm in well-lit settings. GM2, like GW1, adopts DCG as well for added performance and Super PD for fast autofocus.
Samsung ISOCELL Bright GW1 and GM2 are currently sampling and are expected to be in mass production in the second half of this year.
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“With more pixels and advanced pixel technologies, Samsung ISOCELL Bright GW1 and GM2 will bring a new level of photography to today’s sleekest mobile devices that will enhance and help change the way we record our daily lives,” said Yongin Park, EVP of sensor business at Samsung Electronics.
With pixel-merging Tetracell technology and remosaic algorithm, GW1 can produce 16MP images in low-light environments and highly-detailed 64MP shots in brighter settings. GW1 supports real-time HDR of up to 100dB. In comparison, the dynamic range of a conventional image sensor is at around 60dB, while that of the human eye is typically considered to be around 120dB.
GW1 is equipped with a Dual Conversion Gain (DCG) that converts the received light into an electric signal according to the illumination of the environment. This allows the sensor to optimize its FWC. Sharper results can be delivered through Super PD, a high-performance phase detection auto-focus technology, and full HD recording at 480fps is supported.
ISOCELL Bright GM2 is a 48MP image sensor that also adopts Tetracell technology in low-light environments and a remosaic algorithm in well-lit settings. GM2, like GW1, adopts DCG as well for added performance and Super PD for fast autofocus.
Samsung ISOCELL Bright GW1 and GM2 are currently sampling and are expected to be in mass production in the second half of this year.
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Himax Quarterly Update: Smartphone 3D Sensing, Low Power Imaging
SeekingAlpha: Himax Q1 2019 earnings call gives an update on its imaging business:
"First on 3D Sensing business update. At present, Android smartphone’s front facing 3D sensing adoption is still hindered by the high hardware cost, long development lead time, and the lack of killer applications. Instead of 3D sensing, most of the Android phone makers have chosen the fingerprint technology which can achieve similar phone unlock and online payment functions with a much lower cost.
Reacting to their lukewarm response, we started to work on the next generation SLiM 3D sensing total solution, aiming to leapfrog the market by providing high performance, easy to adopt and yet cost friendly total solutions, targeting the majority of Android smartphone players.
Currently we have completed the feasibility study for its Gen 2 SLiM solutions covering detailed specifications, performance and cost. Our next step is to seek feedback from Android smartphone OEMs. With that, we will then determine the way forward for its 3D sensing total solution strategy.
For the avoidance of doubt, we remain and are committed to be the leader in the optics for structured light 3D sensing where we are currently engaged in multiple development projects from multiple customers.
Being a leading provider of 3D sensing technology, we are also an active participant in smartphone OEMs’ design projects for new devices involving ToF technology. We see ToF building momentum in such use cases as advanced photography, distance or dimension measurement and 3D depth information generation for AR.
Unlike structured light 3D sensing where it provides total solution or just projector module or optics depending on customers’ needs, with ToF, we only – we will only focus on transmitter module by leveraging its WLO related expertise.
I mentioned previously that 3D sensing can have a wide range of applications beyond smartphone. We have started to explore business opportunities in various industries that are typically less sensitive to cost and always require a total solution.
Among such projects is a collaboration effort with Kneron, an industry leader in edge-based artificial intelligence in which we have made an equity investment, to develop an AI-enabled 3D sensing solution targeting security and surveillance markets. We are also working with partners/customers on new applications covering home appliances and industrial manufacturing.
On CMOS image sensor business updates. We continue to make great progress with our machine-vision sensor product lines. Himax and Emza unveiled the second generation WiseEye AIoT intelligent vision solution at the ISC West 2019 in early April.
The solution is consisted of Himax’s industry leading ultra-low power sensor and ASIC designs with Emza’s unique AI-based, ultra-low power computer vision algorithm. The solution is uniquely positioned for AIoT markets featuring battery-powered human detection sensor, AI-based machine learning and always-on visual sensor, all operating at the edge device.
Furthermore, it brings an enhanced user experience and better-informed decision-making running on minimal power and much better cost compared to similar solutions consuming much higher power.
We are pleased with the status of engagement with leading players in areas such as connected home, smart building and security. In parallel, we are actively participating in the rapidly growing AIoT eco-system, which we believe will open up further future opportunities for Himax.
For traditional human vision segments, we see strong demands in laptop and increasing shipment for multimedia applications such as car recorders, surveillance, drones, home appliances, and consumer electronics, among others."
"First on 3D Sensing business update. At present, Android smartphone’s front facing 3D sensing adoption is still hindered by the high hardware cost, long development lead time, and the lack of killer applications. Instead of 3D sensing, most of the Android phone makers have chosen the fingerprint technology which can achieve similar phone unlock and online payment functions with a much lower cost.
Reacting to their lukewarm response, we started to work on the next generation SLiM 3D sensing total solution, aiming to leapfrog the market by providing high performance, easy to adopt and yet cost friendly total solutions, targeting the majority of Android smartphone players.
Currently we have completed the feasibility study for its Gen 2 SLiM solutions covering detailed specifications, performance and cost. Our next step is to seek feedback from Android smartphone OEMs. With that, we will then determine the way forward for its 3D sensing total solution strategy.
For the avoidance of doubt, we remain and are committed to be the leader in the optics for structured light 3D sensing where we are currently engaged in multiple development projects from multiple customers.
Being a leading provider of 3D sensing technology, we are also an active participant in smartphone OEMs’ design projects for new devices involving ToF technology. We see ToF building momentum in such use cases as advanced photography, distance or dimension measurement and 3D depth information generation for AR.
Unlike structured light 3D sensing where it provides total solution or just projector module or optics depending on customers’ needs, with ToF, we only – we will only focus on transmitter module by leveraging its WLO related expertise.
I mentioned previously that 3D sensing can have a wide range of applications beyond smartphone. We have started to explore business opportunities in various industries that are typically less sensitive to cost and always require a total solution.
Among such projects is a collaboration effort with Kneron, an industry leader in edge-based artificial intelligence in which we have made an equity investment, to develop an AI-enabled 3D sensing solution targeting security and surveillance markets. We are also working with partners/customers on new applications covering home appliances and industrial manufacturing.
On CMOS image sensor business updates. We continue to make great progress with our machine-vision sensor product lines. Himax and Emza unveiled the second generation WiseEye AIoT intelligent vision solution at the ISC West 2019 in early April.
The solution is consisted of Himax’s industry leading ultra-low power sensor and ASIC designs with Emza’s unique AI-based, ultra-low power computer vision algorithm. The solution is uniquely positioned for AIoT markets featuring battery-powered human detection sensor, AI-based machine learning and always-on visual sensor, all operating at the edge device.
Furthermore, it brings an enhanced user experience and better-informed decision-making running on minimal power and much better cost compared to similar solutions consuming much higher power.
We are pleased with the status of engagement with leading players in areas such as connected home, smart building and security. In parallel, we are actively participating in the rapidly growing AIoT eco-system, which we believe will open up further future opportunities for Himax.
For traditional human vision segments, we see strong demands in laptop and increasing shipment for multimedia applications such as car recorders, surveillance, drones, home appliances, and consumer electronics, among others."
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Lens Limitations
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Lidar Sampling ROIC
IEICE Electronics Express publishes Tianjin University, China, paper "A novel TDC/ADC hybrid reconstruction ROIC for LiDAR" by Xianzhao Xia, Mao Ye, Jiaji He, Kai Hu, and Yiqiang Zhao.
"A novel low complexity TDC/ADC hybrid reconstruction read-out circuit (ROIC) is proposed for LiDAR. Compared with other TDC-based receivers, the proposed circuit can provide a higher sampling speed, while consuming less power than ADC-based receivers. The circuit structure is constructed based on a sampler circuit to realize full waveform reconstruction. To further reduce power consumption, a Time Control Technique (TCT) is utilized to enable the sampler circuit to work only when needed. More specifically, the bandwidth, gain and input referred noise current spectral density of analog front-end (AFE) circuit are set as 150 M, 83 dB and 3.25 pA/sqrt (Hz), respectively. The experiment results demonstrate the feasibility that the sampler circuit can reach more than 3 GHz sampling frequency with only 2.8 mW power consumption."
While claimed "novel," the principle looks quite similar to ASC-Continental LiDAR and probably shares the same advantages and weaknesses:
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"A novel low complexity TDC/ADC hybrid reconstruction read-out circuit (ROIC) is proposed for LiDAR. Compared with other TDC-based receivers, the proposed circuit can provide a higher sampling speed, while consuming less power than ADC-based receivers. The circuit structure is constructed based on a sampler circuit to realize full waveform reconstruction. To further reduce power consumption, a Time Control Technique (TCT) is utilized to enable the sampler circuit to work only when needed. More specifically, the bandwidth, gain and input referred noise current spectral density of analog front-end (AFE) circuit are set as 150 M, 83 dB and 3.25 pA/sqrt (Hz), respectively. The experiment results demonstrate the feasibility that the sampler circuit can reach more than 3 GHz sampling frequency with only 2.8 mW power consumption."
While claimed "novel," the principle looks quite similar to ASC-Continental LiDAR and probably shares the same advantages and weaknesses:
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Emberion Graphene Imagers
A 2018 Emberion presentation gives quite a lot o information about the company's progress and products:
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An earlier 2017 presentation compares graphene sensors with incumbent technologies.
An earlier 2017 presentation compares graphene sensors with incumbent technologies.
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SiOnyx vs Hamamatsu Lawsuit Outcome
Law360: The Boston, MA jury's verdict is said to be entirely in favor of SiOnyx LLC, the Black Silicon company, co-founded by Harvard professor Eric Mazur and the President and Fellows of Harvard College (see the previous post here). The jury found that U.S. subsidiary Hamamatsu Corp. breached its NDA with SiOnyx and infringed its US8080467 patent on special laser-processed silicon.
"The jury awarded SiOnyx $796,469 in damages on its breach of contract claim and $580,640 on its claim for unjust enrichment, and rejected Hamamatsu's defense that SiOnyx's claims were filed too late.
The jury also found that Japanese parent company Hamamatsu Photonics KK infringed the patent willfully, but awarded no damages for patent infringement. Moreover, the jury found that SiOnyx co-founder James Carey should have been listed as a co-inventor on nine patents filed by Hamamatsu.
In 2006, SiOnyx demonstrated its technology to Hamamatsu, only to have the Japanese company file its own patent applications on that same technology, breaching the companies' mutual nondisclosure agreement, according to the complaint.
Hamamatsu had acted like it was entering into a collaborative relationship with SiOnyx to explore using the black silicon in its commercial semiconductor products, but began selling products using the technology without giving credit to the actual inventors, according to the complaint."
Hamamatsu Photonics K.K. US patents 9,614,109; 9,293,499; 9,190,551; 8,994,135; 8,916,945; 8,884,226; 8,742,528; 8,629,485; and 8,564,087 should include SiOnyx co-founder James Carey as co-inventor, according to the jury.
"The jury awarded SiOnyx $796,469 in damages on its breach of contract claim and $580,640 on its claim for unjust enrichment, and rejected Hamamatsu's defense that SiOnyx's claims were filed too late.
The jury also found that Japanese parent company Hamamatsu Photonics KK infringed the patent willfully, but awarded no damages for patent infringement. Moreover, the jury found that SiOnyx co-founder James Carey should have been listed as a co-inventor on nine patents filed by Hamamatsu.
In 2006, SiOnyx demonstrated its technology to Hamamatsu, only to have the Japanese company file its own patent applications on that same technology, breaching the companies' mutual nondisclosure agreement, according to the complaint.
Hamamatsu had acted like it was entering into a collaborative relationship with SiOnyx to explore using the black silicon in its commercial semiconductor products, but began selling products using the technology without giving credit to the actual inventors, according to the complaint."
Hamamatsu Photonics K.K. US patents 9,614,109; 9,293,499; 9,190,551; 8,994,135; 8,916,945; 8,884,226; 8,742,528; 8,629,485; and 8,564,087 should include SiOnyx co-founder James Carey as co-inventor, according to the jury.
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IISW 2019 Program
International Image Sensor Workshop to be help in Snowbird, UT on June 24-27, 2019 publishes its program. There are 55 regular papers and 33 posters in the program this year.
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HIDM - Chinese Image Sensor IDM
It has been a while since my previous post about Huaian Imaging Device Manufacturer Corp (HIDM). A lot more becomes known about the company and its business:
"HiDM was founded in January 19, 2016, and the total investment is expected to exceed 50 billion RMB. The headquarters is located in Huai’an, Jiangsu, China. The first phase of the project is expected to invest 15 billion Yuan for the 12-inch wafer fab with an annual output of 240,000 wafers, covering an area of 257 acres and has been basically completed. It is a semiconductor company focusing on CMOS Image Sensor.
Our company takes mobile phone camera chip as the breakthrough point, and integrates resources, technology, channels and customers in an all-round way. It is in the leading position in the industry from design, production to sales. Besides, we have maintained stable cooperative relationship with HUAWEI and other mobile phone leading enterprises and the market prospect is really broad.
Now we have obtained technological platform authorization from a European semiconductor company. Our products are widely used in mobile phones, monitoring, vehicle, IOT, medical, robot and other fields. In April 2016, Toshiba CIS technology core team was built to join HiDM, the product design and R & D team came from the Toshiba team. At present, our company has a complete set of advanced design and independent process capability with world-class technological level."
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ON Semi reports it has licensed its mobile imaging related assets to HIDM:
"On December 19, 2016, the Company entered into an Asset Purchase Agreement (the “Asset Purchase Agreement”) with HSET Electronic Tech (Hong Kong) Limited (“HSET”) to sell inventory and license patents related to its Mobile CIS business for $75.0 million. On April 7, 2017, the Company and HSET along with Huaian Imaging Device Manufacturer Corporation (“HIDM”) entered into the First Amendment to the Asset Purchase Agreement. The arrangement included the sale of $22.5 million of inventory, which has been recorded as revenue for the year ended December 31, 2017.
During 2017, the Company received the remaining $52.5 million and provided perpetual, non-exclusive licenses to certain technologies to HIDM."
In 2018, HIDM has filed 279 patent applications and is ranking #65 in the world:
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"HiDM was founded in January 19, 2016, and the total investment is expected to exceed 50 billion RMB. The headquarters is located in Huai’an, Jiangsu, China. The first phase of the project is expected to invest 15 billion Yuan for the 12-inch wafer fab with an annual output of 240,000 wafers, covering an area of 257 acres and has been basically completed. It is a semiconductor company focusing on CMOS Image Sensor.
Our company takes mobile phone camera chip as the breakthrough point, and integrates resources, technology, channels and customers in an all-round way. It is in the leading position in the industry from design, production to sales. Besides, we have maintained stable cooperative relationship with HUAWEI and other mobile phone leading enterprises and the market prospect is really broad.
Now we have obtained technological platform authorization from a European semiconductor company. Our products are widely used in mobile phones, monitoring, vehicle, IOT, medical, robot and other fields. In April 2016, Toshiba CIS technology core team was built to join HiDM, the product design and R & D team came from the Toshiba team. At present, our company has a complete set of advanced design and independent process capability with world-class technological level."
ON Semi reports it has licensed its mobile imaging related assets to HIDM:
"On December 19, 2016, the Company entered into an Asset Purchase Agreement (the “Asset Purchase Agreement”) with HSET Electronic Tech (Hong Kong) Limited (“HSET”) to sell inventory and license patents related to its Mobile CIS business for $75.0 million. On April 7, 2017, the Company and HSET along with Huaian Imaging Device Manufacturer Corporation (“HIDM”) entered into the First Amendment to the Asset Purchase Agreement. The arrangement included the sale of $22.5 million of inventory, which has been recorded as revenue for the year ended December 31, 2017.
During 2017, the Company received the remaining $52.5 million and provided perpetual, non-exclusive licenses to certain technologies to HIDM."
In 2018, HIDM has filed 279 patent applications and is ranking #65 in the world:
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Hyperspectral Vision in Sea Depth
Science: "At a depth of 1000 meters, the last glimmer of sunlight is gone. But over the past 15 years, researchers have realized that the depths are pervaded by a faint bioluminescence from flashing shrimp, octopus, bacteria, and even fish. To learn how fish can see it, a team led by evolutionary biologist Walter Salzburger from the University of Basel in Switzerland studied deep-sea fishes' opsin proteins. Variation in the opsins' amino acid sequences changes the wavelength of light detected, so multiple opsins make color vision possible. One opsin, RH1, works well in low light. Found in the eye's rod cells, it enables humans to see in the dark—but only in black and white.
Salzburger and his colleagues searched for opsin genes in 101 fish species, including seven Atlantic Ocean deep-sea fish whose genomes they fully sequenced. Most fish have one or two RH1 opsins, like many other vertebrates, but four of the deep-sea species stood apart, the researchers report this week in Science. Those fish—the lantern-fish, a tube-eye fish, and two spinyfins—all had at least five RH1 genes, and one, the silver spinyfin (Diretmus argenteus), had 38."
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Salzburger and his colleagues searched for opsin genes in 101 fish species, including seven Atlantic Ocean deep-sea fish whose genomes they fully sequenced. Most fish have one or two RH1 opsins, like many other vertebrates, but four of the deep-sea species stood apart, the researchers report this week in Science. Those fish—the lantern-fish, a tube-eye fish, and two spinyfins—all had at least five RH1 genes, and one, the silver spinyfin (Diretmus argenteus), had 38."
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Samsung CIS Sales are $2.46b
BusinessKorea: "Although we presented our goal of becoming the No. 1 player in the system semiconductor sector in 2030, we don't want to wait that long in the sensor market," said Park Yong-in, EVP for Samsung’s sensor business.
Park said Samsung’s sensor business has barely started but its sales can grow to the level of memory semiconductors in the future. Noting that Samsung Electronics' sales in its memory semiconductor business grew 4.5 times from $1.9b in 1992 to $8.6b in 2002, Park said he expects the company’s image sensor sales, which currently stand at $2.46b, to grow at a similar pace.
KoreaJoongAngDaily: “One-third of the global population is using our mobile image sensors. By this year’s second half, most high-end smartphone makers will be using 64-megapixel camera phones,” Park said.
KoreaBizWire: “Vehicle components are the next market for image sensors,” Kwon Jin-hyun, VP of Samsung’s System LSI sensor marketing, said.
Sony accounted for 26.1% of the global image sensor market in 2018, followed by Samsung’s with 23.2%, according to Japanese TSR. BusinessKorea gives different numbers: Sony controls 50.1% share, Samsung follows with 20.5%.
Park said Samsung’s sensor business has barely started but its sales can grow to the level of memory semiconductors in the future. Noting that Samsung Electronics' sales in its memory semiconductor business grew 4.5 times from $1.9b in 1992 to $8.6b in 2002, Park said he expects the company’s image sensor sales, which currently stand at $2.46b, to grow at a similar pace.
KoreaJoongAngDaily: “One-third of the global population is using our mobile image sensors. By this year’s second half, most high-end smartphone makers will be using 64-megapixel camera phones,” Park said.
KoreaBizWire: “Vehicle components are the next market for image sensors,” Kwon Jin-hyun, VP of Samsung’s System LSI sensor marketing, said.
Sony accounted for 26.1% of the global image sensor market in 2018, followed by Samsung’s with 23.2%, according to Japanese TSR. BusinessKorea gives different numbers: Sony controls 50.1% share, Samsung follows with 20.5%.
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| Park Yong-in, EVP of sensor business at Samsung, presents new image sensors during a press briefing held in Seoul on May 9, 2019. Note a nice ISOCELL physical demo on the right side. |
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OmniVision Announces Automotive ISP Featuring HDR with LED Flicker Mitigation
PRNewswire: OmniVision announces the OAX4010 automotive ISP featuring the new HDR and LFM Engine (HALE) combination algorithm. In tandem with OmniVision’s OX01A10 and OX02A10 LFM image sensors, the OAX4010 enables more intelligent decision-making by providing the LFM and HDR simultaneously, while operating over the automotive temperature range. Additionally, the OAX4010 can process the images from one camera at 60fps or two cameras at 30fps, which reduces the number of ISPs required for surround-view system (SVS) cameras by 50%.
“With the ongoing transition from SoCs to stand-alone ISPs for automotive viewing, these systems are increasingly incorporating ADAS requirements such as LFM and HDR,” said Pierre Cambou, principal imaging analyst at Yole Développement. “The ability to provide state-of-the-art companion ISPs is becoming a key technology requirement for image sensor suppliers to automotive tier ones and OEMs, as they tackle the numerous new features like parking assist and e-mirrors. OmniVision is the main contender in that space and is effectively driving the technology forward.”
“With our ISP’s proprietary HALE combination algorithm, automotive designers can create camera systems without compromise that are flicker-free while achieving the full dynamic range,” said Andy Hanvey, director of automotive marketing at OmniVision. “LFM and HDR can be optimized together to give drivers a better picture of their surroundings."
OAX4010 samples are available now, and it is AEC-Q100 Grade 2 certified and ASPICE CL-2 for automotive applications.
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“With the ongoing transition from SoCs to stand-alone ISPs for automotive viewing, these systems are increasingly incorporating ADAS requirements such as LFM and HDR,” said Pierre Cambou, principal imaging analyst at Yole Développement. “The ability to provide state-of-the-art companion ISPs is becoming a key technology requirement for image sensor suppliers to automotive tier ones and OEMs, as they tackle the numerous new features like parking assist and e-mirrors. OmniVision is the main contender in that space and is effectively driving the technology forward.”
“With our ISP’s proprietary HALE combination algorithm, automotive designers can create camera systems without compromise that are flicker-free while achieving the full dynamic range,” said Andy Hanvey, director of automotive marketing at OmniVision. “LFM and HDR can be optimized together to give drivers a better picture of their surroundings."
OAX4010 samples are available now, and it is AEC-Q100 Grade 2 certified and ASPICE CL-2 for automotive applications.
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Sheba Presents its MEMS AF and OIS Solution
Toronto, Canada-based Sheba Microsystems kindly sent me a presentation about its MEMS AF and OIS solution:
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Autosens Expands in Hong Kong in 2020
In addition to the conferences in Brussels and Detroit, Autosens announces a third location for its yearly events - Hong Kong:
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Optical Fingerprint News
Imec: Holst Centre, an innovation initiative of imec and TNO, has developed a large-area optical fingerprint sensor that is over 70% transparent for integrating on top of LCD displays. At 70% transparency in the visible region, the new prototype is said to be the most transparent large-area optical fingerprint sensor yet. It is based on a combination of organic photodiodes (OPD), thin-film barrier and oxide thin-film transistors (TFTs) pioneered by Holst Centre. To achieve the high transparency, the team uses photolithography to pattern the photodiode layer within each pixel, creating microscopic islands of photosensitive material.
The transparent sensor offers high resolution and dynamic range with a low dark current, ensuring excellent sensitivity even in low light conditions. It can also be produced in large sizes for example to read palmprints or 4 fingerprints at once. This combination of size and performance enables compliance with FAP 60, the FBI’s most-stringent certification category.
It also allows the sensor to work as a document scanner, for example allowing a single system to read passports and fingerprints while also providing user guidance. Moreover, the new sensor can be used in combination with the highly transparent capacitive touch panels commonly used in LCD screens, enabling simultaneous touch and biometric functionality.
“Integrating biometric sensors into displays allows the display to give people better guidance on how to use the system and exactly where to put their hand. This would make identification, for example at customs, more reliable and much faster. Our patterned pixel design ensures high transparency and is completely compatible with existing flat-panel display production processes, making integration with widely used LCD displays both technically feasible and cost effective,” said Hylke Akkerman, Program Manager at Holst Centre.
As with Holst Centre’s previous fingerprint sensors, the transparent sensor is also capable of detecting a heartbeat while reading a fingerprint for liveness detection. Changes to the photodiode chemistry would allow the sensor to work in the NIR to detect the pattern of veins in the hand, offering additional ways to verify a person’s identity.
Holst Centre will also be showing three further fingerprint innovations including a high-resolution sensor integrated under a display using Holst Centre’s proprietary collimator technology as well as an in-display sensor concept that uses photolithography patterning to integrate OLED and OPD pixels side-by-side. This latter approach could allow 500 ppi fingerprint scanners to be integrated into ultra-high resolution display arrays such as single AMOLED modules with multiple functionalities. On the design side, Holst Centre will demonstrate integrated readout electronics for on-display-panel fingerprint detection.
“Integrating microscopic photodetectors within AMOLED arrays adds light sensitivity to display pixels. Through photolithography patterning, we envision ultra-high resolution arrays of OLEDs and OPD that maximize the usage of the active area. At the same time, in-panel readout blocks could facilitate further scaling of fingerprint scanners for a more-efficient user interface,” adds Pawel Malinowski, Program Manager at imec.
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PRNewswire: AU Optronics (AUO) unveils what it calls the world' first full screen optical in-cell fingerprint LTPS LCD, in-cell touch LTPS LCDs with the world's smallest through-hole design and narrowest(*)1.0 mm bottom border for smartphone applications. AUO's 6-inch full screen optical in-cell fingerprint LTPS LCD is the first of its kind to have installed an optical sensor within the LCD structure. Equipped with AHVA technology, full HD+ (1080 x 2160) resolution and 403 PPI pixel density, the panel has a full screen sensing area with the same 403 PPI sensor density and 30 ms swift sensor response time for the smoothest and most accurate sensing performance possible on a smartphone.
Also applying the AHVA technology, the 6.3-inch in-cell touch LTPS LCD has full HD+ (1080 x 2304) resolution and possesses the world's narrowest 1.0 mm bottom border, which is around 40% narrower than that of its counterpart in the market.
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The transparent sensor offers high resolution and dynamic range with a low dark current, ensuring excellent sensitivity even in low light conditions. It can also be produced in large sizes for example to read palmprints or 4 fingerprints at once. This combination of size and performance enables compliance with FAP 60, the FBI’s most-stringent certification category.
It also allows the sensor to work as a document scanner, for example allowing a single system to read passports and fingerprints while also providing user guidance. Moreover, the new sensor can be used in combination with the highly transparent capacitive touch panels commonly used in LCD screens, enabling simultaneous touch and biometric functionality.
“Integrating biometric sensors into displays allows the display to give people better guidance on how to use the system and exactly where to put their hand. This would make identification, for example at customs, more reliable and much faster. Our patterned pixel design ensures high transparency and is completely compatible with existing flat-panel display production processes, making integration with widely used LCD displays both technically feasible and cost effective,” said Hylke Akkerman, Program Manager at Holst Centre.
As with Holst Centre’s previous fingerprint sensors, the transparent sensor is also capable of detecting a heartbeat while reading a fingerprint for liveness detection. Changes to the photodiode chemistry would allow the sensor to work in the NIR to detect the pattern of veins in the hand, offering additional ways to verify a person’s identity.
Holst Centre will also be showing three further fingerprint innovations including a high-resolution sensor integrated under a display using Holst Centre’s proprietary collimator technology as well as an in-display sensor concept that uses photolithography patterning to integrate OLED and OPD pixels side-by-side. This latter approach could allow 500 ppi fingerprint scanners to be integrated into ultra-high resolution display arrays such as single AMOLED modules with multiple functionalities. On the design side, Holst Centre will demonstrate integrated readout electronics for on-display-panel fingerprint detection.
“Integrating microscopic photodetectors within AMOLED arrays adds light sensitivity to display pixels. Through photolithography patterning, we envision ultra-high resolution arrays of OLEDs and OPD that maximize the usage of the active area. At the same time, in-panel readout blocks could facilitate further scaling of fingerprint scanners for a more-efficient user interface,” adds Pawel Malinowski, Program Manager at imec.
PRNewswire: AU Optronics (AUO) unveils what it calls the world' first full screen optical in-cell fingerprint LTPS LCD, in-cell touch LTPS LCDs with the world's smallest through-hole design and narrowest(*)1.0 mm bottom border for smartphone applications. AUO's 6-inch full screen optical in-cell fingerprint LTPS LCD is the first of its kind to have installed an optical sensor within the LCD structure. Equipped with AHVA technology, full HD+ (1080 x 2160) resolution and 403 PPI pixel density, the panel has a full screen sensing area with the same 403 PPI sensor density and 30 ms swift sensor response time for the smoothest and most accurate sensing performance possible on a smartphone.
Also applying the AHVA technology, the 6.3-inch in-cell touch LTPS LCD has full HD+ (1080 x 2304) resolution and possesses the world's narrowest 1.0 mm bottom border, which is around 40% narrower than that of its counterpart in the market.
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177dB Linear DR Camera
IEEE Photonics Journal publishes an open access paper "177 dB Linear Dynamic Range Pixels of Interest DSLR CAOS Camera" by Nabeel A. Riza and Mohsin A. Mazhar from University College Cork, Cork, Ireland.
"A camera with extreme linear dynamic range (DR) and controllable signal-to-noise ratio (SNR) for pixel irradiance extraction has remained an elusive goal for imager designers to allow reliable mapping under extreme contrast scenarios such as night vision. Presented is the DSLR CAOS camera that meets this elusive goal with a 3 detector imager design. This paper demonstrates a record 177 dB linear DR controllable SNR pixel irradiance extractions and first time real-time CAOS-mode image capture.
For the first time, demonstrated is an extreme linear Dynamic Range (DR) Pixels of Interest (POI) [i.e., Coded Access Optical Sensor (CAOS)] Digital Single Lens Reflex (DSLR) camera design that engages three different types of photosensors within one optomechanical assembly to smartly identify POI across a one billion to one light irradiance range. A pixelated CMOS sensor provides a limited DR and linearity image by engaging a moveable mirror placed between the Digital Micromirror Device (DMD) and the frontend imaging lens. Next using DMD control, non-POI light is directed away from the chosen point photodetector (PD) engaged for high DR POI image recovery, giving the PD an improved use of quantum well capacity. For brighter POI, a solid state photodiode point PD with an electronic gain controlled amplifier is engaged while for weaker light POI, a photomultiplier tube (PMT) with variable optical gain is deployed. POI imaging is achieved using time-frequency CAOS modes via DMD control and time-frequency correlation and spectral digital signal processing. A 123.4 dB linear DR POI recovery is achieved for a custom incoherent white light 36-patch target while a record 177 dB linear DR recovery is demonstrated for a single patch 633 nm laser target. For the first time, a 1023 POI frame, real-time 48 frames/s update rate CAOS imaging is demonstrated for tracking a changing focal spot moving laser target."
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"A camera with extreme linear dynamic range (DR) and controllable signal-to-noise ratio (SNR) for pixel irradiance extraction has remained an elusive goal for imager designers to allow reliable mapping under extreme contrast scenarios such as night vision. Presented is the DSLR CAOS camera that meets this elusive goal with a 3 detector imager design. This paper demonstrates a record 177 dB linear DR controllable SNR pixel irradiance extractions and first time real-time CAOS-mode image capture.
For the first time, demonstrated is an extreme linear Dynamic Range (DR) Pixels of Interest (POI) [i.e., Coded Access Optical Sensor (CAOS)] Digital Single Lens Reflex (DSLR) camera design that engages three different types of photosensors within one optomechanical assembly to smartly identify POI across a one billion to one light irradiance range. A pixelated CMOS sensor provides a limited DR and linearity image by engaging a moveable mirror placed between the Digital Micromirror Device (DMD) and the frontend imaging lens. Next using DMD control, non-POI light is directed away from the chosen point photodetector (PD) engaged for high DR POI image recovery, giving the PD an improved use of quantum well capacity. For brighter POI, a solid state photodiode point PD with an electronic gain controlled amplifier is engaged while for weaker light POI, a photomultiplier tube (PMT) with variable optical gain is deployed. POI imaging is achieved using time-frequency CAOS modes via DMD control and time-frequency correlation and spectral digital signal processing. A 123.4 dB linear DR POI recovery is achieved for a custom incoherent white light 36-patch target while a record 177 dB linear DR recovery is demonstrated for a single patch 633 nm laser target. For the first time, a 1023 POI frame, real-time 48 frames/s update rate CAOS imaging is demonstrated for tracking a changing focal spot moving laser target."
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ON Semi HDR with LED Flicker Mitigation
ON Semi posts a video explaining its Hayabusa image sensor family Super-Exposure feature: HDR with LED flicker mitigation:
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imec On- and Under-Display Large Area Image Sensors
Imec kindly sent me more info on its thin-film on-display image sensor that can be used for fingerprint or other scanning applications:
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Actlight Closes Series C Financing Round
PRNewswire: ActLight SA announces the closing of its Series C equity financing. The amount of raised money has not been not reported. Swisscom Venture served as the lead investor, along with investiere.ch, new investor Quan Funds and other private investors. ActLight SA intends to use the financing to support further advancement of its TOF solutions, particularly to produce demonstrators of 3D TOF Sensor Arrays and Single Photon Range Meters, which are designed to significantly improve the depth sensing performances in smartphones, self-driving vehicles and other innovative devices.
"This financing round is a significant milestone for us as we continue to advance our technology pipeline and we would like to welcome all of our new and current investors and thank them for sharing our entrepreneurial vision. They help us shaping the future of light sensing," said Serguei Okhonin, Co-Founder and CEO. "With these funds, we intend to pursue the development of very innovative TOF light sensors which we believe can respond to the big needs of innovation in depth sensing and expand the array of applications in this field."
ActLight SA patented the Dynamic PhotoDiode is said to allow enhance the efficiency and accuracy of various light sensing applications like TOF based distance measuring (i.e. user detection, gesture control and visual recognition), vital signs monitoring, 3D/2D cameras and much more. The Dynamic PhotoDiode has been chosen and licensed by a leading semiconductor company to be integrated in one of their chips for vital signs monitoring in wearable devices; more deals in different markets are progressing in our opportunity pipeline.
ActLight SA operates on mobile and wearable devices, healthcare, autonomous driving, drones and robotics markets.
"This financing round is a significant milestone for us as we continue to advance our technology pipeline and we would like to welcome all of our new and current investors and thank them for sharing our entrepreneurial vision. They help us shaping the future of light sensing," said Serguei Okhonin, Co-Founder and CEO. "With these funds, we intend to pursue the development of very innovative TOF light sensors which we believe can respond to the big needs of innovation in depth sensing and expand the array of applications in this field."
ActLight SA patented the Dynamic PhotoDiode is said to allow enhance the efficiency and accuracy of various light sensing applications like TOF based distance measuring (i.e. user detection, gesture control and visual recognition), vital signs monitoring, 3D/2D cameras and much more. The Dynamic PhotoDiode has been chosen and licensed by a leading semiconductor company to be integrated in one of their chips for vital signs monitoring in wearable devices; more deals in different markets are progressing in our opportunity pipeline.
ActLight SA operates on mobile and wearable devices, healthcare, autonomous driving, drones and robotics markets.
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TowerJazz Updates on its CIS Business
SeekingAlpha: TowerJazz quarterly earnings call gives an update on the company image sensor business:
"Moving into the sensors business unit, which includes both our visual CMOS image sensors and non-visual sensors. Within the image sensor activities, our focus remains, firstly, the facial recognition sensor market, primarily in the mobile segment, which is mainly driven by mobile banking and payment applications; secondly, medical and dental market segments, where the served market size continues to increase as x-ray image intensifier tubes and flat panels are replaced by large stitched die, including paneled single die per wafer CMOS sensors; thirdly, high-end imaging, namely, high-end photography and also small pixel global shutter for industrial.
Many applications in these markets are expanding toward differentiated backside illumination and wafer stacking technologies. In all of the above, we continue to serve market leader existing customers for present state-of-the-art market demands as well as customer partner developments with existing and additional new powerful customers, driving breakthrough technologies to capture, for example, among others, the mobile facial recognition platforms for the many suppliers moving past the fingerprint sensors to 3D biometric recognition.
In the non-imaging sensor market, major growth is driven by the IoT market, which requires more and more sophisticated sensors at the edge. We have developed a variety of sensor technologies, including highly accurate and high-range temperature sensors, high sensitivity, as well as high-temperature magnetic sensors, radiation sensors, radon detection sensors, UV sensors and also gas and humidity sensors. We are now actively offering these technologies to customers.
Our recent investment in AIStorm, with proprietary technology, combined with our analog building blocks, provides a breakthrough analog artificial intelligence solution with low-power and low-cost artificial intelligence to edge devices. Our plan is eventually to combine this AI solution with our sensors, enabling smart edge devices for diversified market application."
"Moving into the sensors business unit, which includes both our visual CMOS image sensors and non-visual sensors. Within the image sensor activities, our focus remains, firstly, the facial recognition sensor market, primarily in the mobile segment, which is mainly driven by mobile banking and payment applications; secondly, medical and dental market segments, where the served market size continues to increase as x-ray image intensifier tubes and flat panels are replaced by large stitched die, including paneled single die per wafer CMOS sensors; thirdly, high-end imaging, namely, high-end photography and also small pixel global shutter for industrial.
Many applications in these markets are expanding toward differentiated backside illumination and wafer stacking technologies. In all of the above, we continue to serve market leader existing customers for present state-of-the-art market demands as well as customer partner developments with existing and additional new powerful customers, driving breakthrough technologies to capture, for example, among others, the mobile facial recognition platforms for the many suppliers moving past the fingerprint sensors to 3D biometric recognition.
In the non-imaging sensor market, major growth is driven by the IoT market, which requires more and more sophisticated sensors at the edge. We have developed a variety of sensor technologies, including highly accurate and high-range temperature sensors, high sensitivity, as well as high-temperature magnetic sensors, radiation sensors, radon detection sensors, UV sensors and also gas and humidity sensors. We are now actively offering these technologies to customers.
Our recent investment in AIStorm, with proprietary technology, combined with our analog building blocks, provides a breakthrough analog artificial intelligence solution with low-power and low-cost artificial intelligence to edge devices. Our plan is eventually to combine this AI solution with our sensors, enabling smart edge devices for diversified market application."
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